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ADG3247BRUADN/a7avai2.5 V/3.3 V, 16 Bit (Dual 8 Bit) , 2 Port Level Translator, Bus Switch


ADG3247BRU ,2.5 V/3.3 V, 16 Bit (Dual 8 Bit) , 2 Port Level Translator, Bus SwitchSpecifications subject to change without notice.–2– REV. 0ADG3247ABSOLUTE MAXIMUM RATINGS* LFCSP Pa ..
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ADG3247BRU
2.5 V/3.3 V, 16 Bit (Dual 8 Bit) , 2 Port Level Translator, Bus Switch
REV.0
2.5 V/3.3 V, 16-Bit, 2-Port
Level Translating, Bus Switch
FEATURES
225 ps Propagation Delay through the Switch
4.5 � Switch Connection between Ports
Data Rate 1.244 Gbps
2.5 V/3.3 V Supply Operation
Selectable Level Shifting/Translation
Small Signal Bandwidth 610MHz
Level Translation
3.3 V to 2.5 V
3.3 V to 1.8 V
2.5 V to 1.8 V
40-Lead 6 mm � 6 mm LFCSP and 38-Lead TSSOP
Packages
APPLICATIONS
3.3 V to 1.8 V Voltage Translation
3.3 V to 2.5 V Voltage Translation
2.5 V to 1.8 V Voltage Translation
Bus Switching
Bus Isolation
Hot Plug
Hot Swap
Analog Switching Applications
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTION

The ADG3247 is a 2.5 V or 3.3 V 16-bit, 2-port digital switch.
It is designed on Analog Devices’ low voltage CMOS process,
which provides low power dissipation yet gives high switching
speed and very low on resistance, allowing inputs to be connected
to outputs without additional propagation delay or generating
additional ground bounce noise.
The ADG3247 is organized as dual 8-bit bus switches with
separate bus enable (BEx) inputs. This allows the device to be
used as two 8-bit digital switches or one 16-bit bus switch. These
bus switches allow bidirectional signals to be switched when ON.
In the OFF condition, signal levels up to the supplies are blocked.
This device is ideal for applications requiring level translation.
When operated from a 3.3 V supply, level translation from 3.3V
inputs to 2.5 V outputs occurs. Similarly, if the device is operated
from a 2.5 V supply and 2.5 V inputs are applied, the device will
translate the outputs to 1.8 V. In addition to this, the ADG3247
has a level translating select pin (SEL). When SEL is low, VCC is
reduced internally, allowing for level translation between 3.3V
inputs and 1.8 V outputs. This makes the device suited to appli-
cations requiring level translation between different supplies, such
as converter to DSP/microcontroller interfacing.
PRODUCT HIGHLIGHTS
3.3 V or 2.5 V supply operationExtremely low propagation delay through switch4.5 W switches connect inputs to outputsLevel/voltage translation40-lead 6 mm � 6 mm LFCSP and 38-lead TSSOP packages
ADG3247–SPECIFICATIONS1(VCC = 2.3 V to 3.6 V, GND = 0 V, all specifications TMIN to TMAX, unless otherwise
noted.)

CAPACITANCE
SWITCHING CHARACTERISTICS
NOTESTemperature range is as follows: B Version: –40∞C to +85∞C.Typical values are at 25∞C, unless otherwise stated.Guaranteed by design, not subject to production test.The digital switch contributes no propagation delay other than the RC delay of the typical RON of the switch and the load capacitance when driven by an ideal voltage
source. Since the time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay
of the digital switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side.Propagation delay matching between channels is calculated from the on resistance matching and load capacitance of 50 pF.See Timing Measurement Information section.This current applies to the control pins (BEx) only. The A and B ports contribute no significant ac or dc currents as they transition.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(TA = 25°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
LFCSP Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 32°C/W
TSSOP Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 98°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
Table I.Pin Description
Table II.Truth Table

*SEL = 0 only when VDD = 3.3 V ± 10%
PIN CONFIGURATION
40-Lead LFCSP and 38-Lead TSSOP
PIN 1
INDICATOR
TOP VIEW
ADG3247
NC = NO CONNECT
GND 11
NC 12NC 13NC 14
B15 15B14 1
B13 17B12 18B11 19B10 20
30 B0
29 B1
28 B2
27 B3
26 B4
25 B5
24 B6
23 B7
22 B8
21 B9
40 A539 A438 A337 A236 A135 A033 V
A10
A11
A12
A13
A14
A15
34
SEL
32
BE2
31
BE1
ORDERING GUIDE
ADG3247
TERMINOLOGY

GND
VINH
VINL
IOZ
IOL
RON
�RON
CX OFF
CIN
ICC
�ICC
tPLH, tPHL
tPZH, tPZL
TPC 1.On Resistance vs.
Input Voltage
TPC 4.On Resistance vs. Input
Voltage for Different Temperatures
TPC 7.Pass Voltage vs. VCC
TPC 2.On Resistance vs.
Input Voltage
TPC 5.On Resistance vs. Input
Voltage for Different Temperatures
TPC 8.Pass Voltage vs. VCC
TPC 3.On Resistance vs.
Input Voltage
TPC 6.Pass Voltage vs. VCC
TPC 9.ICC vs. Enable Frequency
ADG3247
TPC 10.Output Low Characteristic
TPC 13.Bandwidth vs. Frequency
TPC 16.Enable/Disable Time
vs. Temperature
TPC 11.Output High Characteristic
TPC 14.Crosstalk vs. Frequency
TPC 17.Enable/Disable Time
vs. Temperature
TPC 12.Charge Injection vs.
Source Voltage
TPC 15.Off Isolation vs.
Frequency
TPC 18.Jitter vs. Data Rate;
PRBS 31
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