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PBSS5330X NXP/PHILIPS N/a4000avaiPBSS5330X; 30 V, 3 A PNP low VCEsat (BISS) transistor


PBSS5330X ,PBSS5330X; 30 V, 3 A PNP low VCEsat (BISS) transistorapplications(e.g. lamps and LEDs)– Inductive load driver (e.g. relays, buzzers2and motors).3DESCRIP ..
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PBSS5330X
PBSS5330X; 30 V, 3 A PNP low VCEsat (BISS) transistor

Philips Semiconductors Product specification
30 V , 3 A
PNP low V CEsat (BISS) transistor PBSS5330X
FEATURES
SOT89 (SC-62) package Low collector-emitter saturation voltage VCEsat High collector current capability: IC and ICM Higher efficiency leading to less heat generation Reduced printed-circuit board requirements.
APPLICATIONS
Power management DC/DC converters Supply line switching Battery charger LCD backlighting. Peripheral drivers Driver in low supply voltage applications
(e.g. lamps and LEDs) Inductive load driver (e.g. relays, buzzers
and motors).
DESCRIPTION

PNP low VCEsat transistor in a SOT89 plastic package.
MARKING
Note
*= p: Made in Hong Kong.= t: Made in Malaysia.= W: Made in China.
QUICK REFERENCE DATA
PINNING
ORDERING INFORMATION
Philips Semiconductors Product specification
30 V , 3 A
PNP low V CEsat (BISS) transistor PBSS5330X
LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; standard footprint. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector1 cm2. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector6 cm2. Device mounted on a ceramic printed-circuit board 7 cm2 , single-sided copper, tin-plated.
Philips Semiconductors Product specification
30 V , 3 A
PNP low V CEsat (BISS) transistor PBSS5330X
Philips Semiconductors Product specification
30 V , 3 A
PNP low V CEsat (BISS) transistor PBSS5330X
THERMAL CHARACTERISTICS
Notes
Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; standard footprint. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector1 cm2. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector6 cm2. Device mounted on a ceramic printed-circuit board 7 cm2 , single-sided copper, tin-plated.
Philips Semiconductors Product specification
30 V , 3 A
PNP low V CEsat (BISS) transistor PBSS5330X
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