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PESD2CANNXPN/a24000avaiCAN bus ESD protection diode


PESD2CAN ,CAN bus ESD protection diodeapplications1.4 Quick reference data Table 1. Quick reference dataSymbol Parameter Conditions Min T ..
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PESD2CAN
CAN bus ESD protection diode
1. Product profile
1.1 General description

PESD2CAN in a small SOT23 Surface-Mounted Device (SMD) plastic package designed
to protect two automotive Controller Area Network (CAN) bus lines from the damage
caused by ElectroStatic Discharge (ESD) and other transients.
1.2 Features and benefits
Max. peak pulse power: PPP =230 W at tp =8/20s Low clamping voltage: VCL =41V at IPP =5A Ultra low leakage current: IRM <1nA ESD protection up to 30kV IEC 61000-4-2, level 4 (ESD) IEC 61000-4-5 (surge); IPP =5A at tp =8/20s AEC-Q101 qualified
1.3 Applications
CAN bus protection Automotive applications
1.4 Quick reference data

2. Pinning information

PESD2CAN
CAN bus ESD protection diode
Rev. 2 — 27 September 2012 Product data sheet
Table 1. Quick reference data
Per diode

VRWM reverse standoff voltage - - 24 V diode capacitance f=1 MHz; VR=0V - 25 30 pF
Table 2. Pinning
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
3. Ordering information

4. Marking

[1] * = placeholder for manufacturing site code.
5. Limiting values

[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to 3 or 2 to 3.
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 3. Ordering information

PESD2CAN - plastic surface-mounted package; 3 leads SOT23
Table 4. Marking codes

PESD2CAN 6R*
Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
Per diode

PPP peak pulse power tp =8/20s [1][2] -230 W
IPP peak pulse current tp =8/20s [1][2] -5 A
Per device
junction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
Table 6. ESD maximum ratings
Per diode

VESD electrostatic discharge voltage IEC 61000-4-2
(contact discharge)
[1][2] -30 kV
machine model [2]- 400 V
MIL-STD-883 (human
body model)
[1][2] -16 kV
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode

Table 7. ESD standards compliance
Per diode

IEC 61000-4-2; level 4 (ESD) >15 kV (air); >8 kV (contact)
MIL-STD-883; class 3B (human body model) >8kV
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
6. Characteristics

[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 8. Characteristics

Tamb =25 C unless otherwise specified.
Per diode

VRWM reverse standoff voltage - - 24 V
IRM reverse leakage current VRWM =24V - <1 10 nA
VBR breakdown voltage IR=1 mA 26.2 28 30.3 V diode capacitance f=1 MHz; VR=0V - 25 30 pF
VCL clamping voltage IPP =1A [1][2] -- 34 V
IPP =5A [1][2] -- 41 V
rdif differential resistance IR =1 mA - - 300 
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode

NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
7. Application information

The PESD2CAN is designed for the protection of two automotive CAN bus lines from the
damage caused by ESD and surge pulses. The PESD2CAN can be used for both,
high-speed CAN bus and fault-tolerant CAN bus protection. The PESD2CAN provides a
surge capability of up to 230 W per line for an 8/20 s waveform.
Circuit board layout and protection device placement:

Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended: Place the PESD2CAN as close to the input terminal or connector as possible. Minimize the path length between the PESD2CAN and the protected line. Keep parallel signal paths to a minimum. Avoid running protection conductors in parallel with unprotected conductors. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops. Minimize the length of the transient return path to ground. Avoid using shared transient return paths to a common ground point. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
8. Test information
8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
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