IC Phoenix
 
Home ›  PP21 > PHB32N06LT,N-channel TrenchMOS logic level FET
PHB32N06LT Fast Delivery,Good Price
Part Number:
If you need More Quantity or Better Price,Welcom Any inquiry.
We available via phone +865332716050 Email
Partno Mfg Dc Qty AvailableDescript
PHB32N06LTNXPN/a16300avaiN-channel TrenchMOS logic level FET
PHB32N06LTNXP/PHN/a10000avaiN-channel TrenchMOS logic level FET


PHB32N06LT ,N-channel TrenchMOS logic level FETApplications„ General purpose switching„ Switched-mode power supplies1.4 Quick reference data Table ..
PHB32N06LT ,N-channel TrenchMOS logic level FETGeneral descriptionLogic level N-channel enhancement mode Field-Effect Transistor (FET) in a plasti ..
PHB33NQ20T ,N-channel TrenchMOS standard level FETGeneral descriptionStandard level N-channel enhancement mode Field-Effect Transistor (FET) in a pla ..
PHB33NQ20T ,N-channel TrenchMOS standard level FETApplications„ DC-to-DC primary side switching1.4 Quick reference data Table 1. Quick referenceSymbo ..
PHB34NQ10T ,N-channel TrenchMOS(tm) transistor
PHB45NQ10T ,N-channel TrenchMOS(tm) transistor
PLDC20G10-25PC ,CMOS Generic 24-Pin Reprogrammable Logic DeviceBlock DiagramI I I I II II I I CP/IVSS12 1011 98 7 6 5 4 3 2 1PROGRAMMABLEANDARRAY8 8 8 8 8 8 8 8 8 ..
PLDC20G10B-15PC ,CMOS Generic 24-Pin Reprogrammable Logic DeviceFunctional Descriptiondifferent configurations are possible, with the two mostCypress PLDC20G10 use ..
PLDC20RA10-20DMB , Reprogrammable Asynchronous CMOS Logic Device
PLDC20RA10-20PC ,Programmable Logic : Programmable Logic DevicesFunctional Description Product-term control of register clock, reset and set and output enable The ..
PLDC20RA10-25DMB , Reprogrammable Asynchronous CMOS Logic Device
PLDC20RA10-25DMB , Reprogrammable Asynchronous CMOS Logic Device


PHB32N06LT
N-channel TrenchMOS logic level FET
PHB32N06LT
N-channel TrenchMOS logic level FET
Rev. 02 — 30 November 2009 Product data sheet Product profile
1.1 General description

Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology. This product is designed and qualified for use in
computing, communications, consumer and industrial applications only.
1.2 Features and benefits
Suitable for logic level gate drive
sources
1.3 Applications
General purpose switching „ Switched-mode power supplies
1.4 Quick reference data
Table 1. Quick reference
VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - - 60 V drain current Tmb =25°C; VGS =5V;
see Figure 1 and 3
--34 A
Ptot total power
dissipation
Tmb =25°C;
see Figure 2
--97 W
Dynamic characteristics

QGD gate-drain charge VGS =5V; ID =20A;
VDS =44V; Tj =25°C;
see Figure 11
-8.5 -nC
Static characteristics

RDSon drain-source
on-state resistance
VGS= 4.5 V; ID =20A; =25°C 31.5 43 mΩ
VGS =5V; ID =20A; =25°C;
see Figure 9 and 10 3040mΩ
NXP Semiconductors PHB32N06LT
N-channel TrenchMOS logic level FET Pinning information

[1] It is not possible to make a connection to pin 2. Ordering information Limiting values
Table 2. Pinning information
gate
SOT404 (D2PAK)
drain [1] source D mounting base; connected to
drain
Table 3. Ordering information

PHB32N06LT D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads (one
lead cropped)
SOT404
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - 60 V
VDGR drain-gate voltage RGS =20kΩ -60 V
VGS gate-source voltage -15 15 V drain current VGS =5V; Tmb= 100 °C; see Figure 1 -24 A
VGS =5V; Tmb =25°C; see Figure 1 and 3 -34 A
IDM peak drain current tp≤10 µs; pulsed; Tmb =25°C; see Figure 3 -136 A
Ptot total power dissipation Tmb =25°C; see Figure 2 -97 W
Tstg storage temperature -55 175 °C junction temperature -55 175 °C
VGSM peak gate-source
voltage
pulsed; tp≤50µs -20 20 V
Source-drain diode
source current Tmb =25°C - 34 A
ISM peak source current tp≤10 µs; pulsed; Tmb =25°C - 136 A
Avalanche ruggedness

EDS(AL)S non-repetitive
VGS =5V; Tj(init) =25°C; ID =20A; Vsup≤25V;
-100 mJ
NXP Semiconductors PHB32N06LT
N-channel TrenchMOS logic level FET
NXP Semiconductors PHB32N06LT
N-channel TrenchMOS logic level FET Characteristics
Table 5. Characteristics
Static characteristics

V(BR)DSS drain-source
breakdown voltage =0.25mA; VGS =0V; Tj =-55°C 55 - - V =0.25mA; VGS =0V; Tj =25°C 60 - - V
VGS(th) gate-source threshold
voltage =1mA; VDS= VGS; Tj =-55 °C;
see Figure 8
--2.3 V =1mA; VDS= VGS; Tj =25°C;
see Figure 8
11.5 2 V =1mA; VDS= VGS; Tj =175 °C;
see Figure 8
0.5 - - V
IDSS drain leakage current VDS =60V; VGS =0V; Tj=25°C - 0.05 10 µA
VDS =60V; VGS =0V; Tj= 175°C - - 500 µA
IGSS gate leakage current VGS =10V; VDS =0V; Tj=25°C - 2 100 nA
VGS =-10 V; VDS =0V; Tj=25°C - 2 100 nA
RDSon drain-source on-state
resistance
VGS =4.5 V; ID =20A; Tj=25°C - 31.5 43 mΩ
VGS =5V; ID =20A; Tj =175 °C;
see Figure 9 and 10
--84 mΩ
VGS =10V; ID =20A; Tj=25°C - 26 37 mΩ
VGS =5V; ID =20A; Tj =25°C;
see Figure 9 and 10
-30 40 mΩ
Dynamic characteristics

QG(tot) total gate charge ID =20A; VDS =44V; VGS =5V; =25°C; see Figure 11
-17 - nC
QGS gate-source charge - 3 - nC
QGD gate-drain charge - 8.5 - nC
Ciss input capacitance VDS =25V; VGS=0 V; f=1 MHz; =25°C; see Figure 12 920 1280 pF
Coss output capacitance - 160 200 pF
Crss reverse transfer
capacitance 100 155 pF
td(on) turn-on delay time VDS =30V; RL =1.2 Ω; VGS =5V;
RG(ext) =10 Ω; Tj =25°C
-14 - ns rise time - 120 - ns
td(off) turn-off delay time - 45 - ns fall time - 55 - ns
Source-drain diode

VSD source-drain voltage IS =25A; VGS =0V; Tj =25°C;
see Figure 7 1.2 V
trr reverse recovery time IS =20A; dIS/dt= -100 A/µs; VGS =-10V;
VDS =30V; Tj =25°C
-36 - ns recovered charge - 70 - nC
NXP Semiconductors PHB32N06LT
N-channel TrenchMOS logic level FET
NXP Semiconductors PHB32N06LT
N-channel TrenchMOS logic level FET
ic,good price


TEL:86-533-2716050      FAX:86-533-2716790
   

©2020 IC PHOENIX CO.,LIMITED