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PHK31NQ03LTPHILIPSN/a150avaiN-channel TrenchMOS logic level FET


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PHK31NQ03LT
N-channel TrenchMOS logic level FET
Product profile1.1 General description
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology. This product is designed and qualified for use in
computing, communications, consumer and industrial applications only.
1.2 Features and benefits
High efficiency due to low switching
and conduction losses Suitable for logic level gate drive
sources
1.3 Applications
DC-to-DC converters Notebook computers Switched-mode power supplies Voltage regulators
1.4 Quick reference data

PHK31NQ03LT
N-channel TrenchMOS logic level FET
Rev. 3 — 11 March 2011 Product data sheet
Table 1. Quick reference data

VDS drain-source voltage Tj≥25 °C; Tj≤ 150°C --30 V drain current Tsp =25°C; VGS =10V;
see Figure 1; see Figure 3
--30.4 A
Ptot total power
dissipation
Tsp =25°C; see Figure 2 --6.9 W
Static characteristics

RDSon drain-source on-state
resistance
VGS =10V; ID =25A; Tj =25°C; see Figure 10;
see Figure 11 3.45 4.4 mΩ
Dynamic characteristics

QGD gate-drain charge VGS =4.5 V; ID =25A;
VDS =12 V; see Figure 12;see Figure 13
-7.7 -nC
NXP Semiconductors PHK31NQ03LT
N-channel TrenchMOS logic level FET Pinning information
Ordering information
Table 2. Pinning information
source
SOT96-1 (SO8)
source source G gate D drain D drain D drain D drain
Table 3. Ordering information

PHK31NQ03LT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
NXP Semiconductors PHK31NQ03LT
N-channel TrenchMOS logic level FET Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage Tj≥25 °C; Tj≤ 150°C - 30 V
VDGR drain-gate voltage Tj≥25 °C; Tj≤ 150 °C; RGS =20kΩ -30 V
VGS gate-source voltage -20 20 V drain current Tsp =25 °C; VGS =10 V; see Figure 1;
see Figure 3 30.4 A
Tsp= 100 °C; VGS =10 V; see Figure 1 - 17.2 A
IDM peak drain current Tsp=25 °C; pulsed; tp≤10µs;
see Figure 3 121.8 A
Ptot total power dissipation Tsp =25 °C; see Figure 2 -6.9 W
Tstg storage temperature -55 150 °C junction temperature -55 150 °C
Source-drain diode
source current Tsp =25°C - 5.7 A
ISM peak source current Tsp=25 °C; pulsed; tp≤10µs - 23.1 A
Avalanche ruggedness

EDS(AL)S non-repetitive drain-source
avalanche energy
VGS =10V; Tj(init) =25°C; ID =35A;
Vsup≤25 V; unclamped; tp= 0.16 ms;
RGS =50Ω 120 mJ
NXP Semiconductors PHK31NQ03LT
N-channel TrenchMOS logic level FET Thermal characteristics

Table 5. Thermal characteristics

Rth(j-sp) thermal resistance from
junction to solder point
--18 K/W
NXP Semiconductors PHK31NQ03LT
N-channel TrenchMOS logic level FET Characteristics
Table 6. Characteristics
Static characteristics

V(BR)DSS drain-source
breakdown voltage =250 µA; VGS =0V; Tj=25°C 30 --V =250 µA; VGS =0V; Tj= -55°C 27 - - V
VGS(th) gate-source threshold
voltage =1mA; VDS =VGS; Tj =25°C;
see Figure 8; see Figure 9
1.3 1.7 2.15 V =1mA; VDS =VGS; Tj= 150 °C;
see Figure 8; see Figure 9
0.8 --V =1mA; VDS =VGS; Tj =-55 °C;
see Figure 8; see Figure 9
--2.6 V
IDSS drain leakage current VDS =30V; VGS =0V; Tj=25°C --1 µA
VDS =30V; VGS =0V; Tj= 150°C - - 100 µA
IGSS gate leakage current VGS =16V; VDS =0V; Tj=25°C - - 100 nA
VGS =-16 V; VDS =0V; Tj=25°C - - 100 nA
RDSon drain-source on-state
resistance
VGS =10V; ID =25A; Tj =25°C;
see Figure 10; see Figure 11 3.45 4.4 mΩ
VGS =10V; ID =25A; Tj= 150 °C;
see Figure 10 5.85 7.5 mΩ
VGS =4.5 V; ID =25A; Tj =25°C;
see Figure 10; see Figure 11 4.25 5.6 mΩ gate resistance f=1 MHz; VGSS(AC) = 150 mV - 1.2 - Ω
Dynamic characteristics

QG(tot) total gate charge ID =25A; VDS =12V; VGS =4.5V;
see Figure 12; see Figure 13
-33 - nC
QGS gate-source charge - 13.6 - nC
QGS1 pre-threshold
gate-source charge
-6.5 -nC
QGS2 post-threshold
gate-source charge
-7.1 -nC
QGD gate-drain charge - 7.7 - nC
VGS(pl) gate-source plateau
voltage =25A; VDS =12V; see Figure 12 -2.85 - V
Ciss input capacitance VDS =0V; VGS =0V; f=1MHz; =25°C 4900 - pF
VDS =12V; VGS=0 V; f=1 MHz; =25°C; see Figure 14 4235 - pF
Coss output capacitance - 840 - pF
Crss reverse transfer
capacitance 370 - pF
td(on) turn-on delay time VDS =12V; RL =0.5 Ω; VGS =4.5V;
RG(ext) =5.6Ω
-37 - ns rise time - 62 - ns
td(off) turn-off delay time - 54 - ns fall time - 26 - ns
NXP Semiconductors PHK31NQ03LT
N-channel TrenchMOS logic level FET

Source-drain diode

VSD source-drain voltage IS =25A; VGS =0V; Tj =25°C;
see Figure 15 0.94 1.2 V
trr reverse recovery time IS =20A; dIS/dt= -100 A/µs; VGS =0V;
VDS =30V
-52 - ns recovered charge IS =20A; dIS/dt= -100 A/µs; VGS =0V - 30 - nC
Table 6. Characteristics …continued
NXP Semiconductors PHK31NQ03LT
N-channel TrenchMOS logic level FET
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