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PHP29N08TNXP/PHN/a10000avaiN-channel TrenchMOS standard level FET


PHP29N08T ,N-channel TrenchMOS standard level FETGeneral descriptionStandard level N-channel enhancement mode Field-Effect Transistor (FET) in a pla ..
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PHP29N08T
N-channel TrenchMOS standard level FET
PHP29N08T
N-channel TrenchMOS standard level FET
Rev. 02 — 12 March 2009 Product data sheet Product profile
1.1 General description

Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology. This product is designed and qualified for use in
computing, communications, consumer and industrial applications only.
1.2 Features and benefits
High noise immunity due to high gate
threshold voltage Low conduction losses due to low
on-state resistance
1.3 Applications
Industrial motor control
1.4 Quick reference data
Table 1. Quick reference
VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - - 75 V drain current Tmb =25°C; VGS =11V;
see Figure 1; see Figure 3
--27 A
Ptot total power
dissipation
Tmb=25 °C; see Figure 2 --88 W
Dynamic characteristics

QGD gate-drain charge VGS =10V; ID =29A;
VDS =60V; Tj =25°C;
see Figure 11 -nC
Static characteristics

RDSon drain-source
on-state resistance
VGS =11V; ID =14A; = 175 °C; see Figure 9;
see Figure 10 96 120 mΩ
VGS =11V; ID =14A; =25 °C; see Figure 9;
see Figure 10 4050mΩ
NXP Semiconductors PHP29N08T
N-channel TrenchMOS standard level FET Pinning information
Ordering information Limiting values
Table 2. Pinning information
gate
SOT78
(TO-220AB; SC-46)
drain source D mounting base, connected to
drain
Table 3. Ordering information

PHP29N08T TO-220AB;
SC-46
plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead
TO-220AB
SOT78
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - 75 V
VDGR drain-gate voltage Tj≤ 175 °C; Tj≥25 °C; RGS =20kΩ -75 V
VGS gate-source voltage -30 30 V drain current VGS =11V; Tmb= 100 °C; see Figure 1 -19.2 A
VGS =11V; Tmb =25°C; see Figure 1;
see Figure 3
-27 A
IDM peak drain current tp≤10 µs; pulsed; Tmb =25°C; see Figure 3 -108 A
Ptot total power dissipation Tmb =25°C; see Figure 2 -88 W
Tstg storage temperature -55 175 °C junction temperature -55 175 °C
Source-drain diode
source current Tmb =25°C - 27 A
ISM peak source current tp≤10 µs; pulsed; Tmb =25°C - 108 A
NXP Semiconductors PHP29N08T
N-channel TrenchMOS standard level FET
NXP Semiconductors PHP29N08T
N-channel TrenchMOS standard level FET Thermal characteristics

Table 5. Thermal characteristics

Rth(j-mb) thermal resistance from
junction to mounting
base
see Figure 4 --1.7 K/W
Rth(j-a) thermal resistance from
junction to ambient
vertical in still air - 60 - K/W
NXP Semiconductors PHP29N08T
N-channel TrenchMOS standard level FET Characteristics
Table 6. Characteristics
Static characteristics

V(BR)DSS drain-source
breakdown voltage =0.25mA; VGS =0V; Tj =-55°C 70 - - V =0.25mA; VGS =0V; Tj =25°C 75 - - V
VGS(th) gate-source threshold
voltage =2mA; VDS = VGS; Tj= 175 °C;
see Figure 8
2.1 - - V =2mA; VDS = VGS; Tj =-55 °C;
see Figure 8
--5.4 V =2mA; VDS = VGS; Tj =25°C;
see Figure 8
345 V
IDSS drain leakage current VDS =75V; VGS =0V; Tj=25°C - 0.05 10 µA
VDS =75V; VGS =0V; Tj= 175°C - - 500 µA
IGSS gate leakage current VGS =20V; VDS =0V; Tj=25°C - 10 100 nA
VGS =-20 V; VDS =0V; Tj=25°C - 10 100 nA
RDSon drain-source on-state
resistance
VGS =11V; ID =14A; Tj= 175 °C;
see Figure 9; see Figure 10
-96 120 mΩ
VGS =11V; ID =14A; Tj =25°C;
see Figure 9; see Figure 10
-40 50 mΩ
Dynamic characteristics

QG(tot) total gate charge ID =29A; VDS =60V; VGS =10V; =25°C; see Figure 11
-19 - nC
QGS gate-source charge - 6 - nC
QGD gate-drain charge - 9 - nC
Ciss input capacitance VDS =25V; VGS=0 V; f=1 MHz; =25°C; see Figure 12 810 - pF
Coss output capacitance - 140 - pF
Crss reverse transfer
capacitance
-85 - pF
td(on) turn-on delay time VDS =38V; RL =1.3 Ω; VGS =10V;
RG(ext) =5.6 Ω; Tj =25°C; ID =29A
-9.5 - ns rise time - 70 - ns
td(off) turn-off delay time - 15 - ns fall time - 9 - ns
Source-drain diode

VSD source-drain voltage IS =14A; VGS =0V; Tj =25°C;
see Figure 13 0.95 1.2 V
trr reverse recovery time IS =14A; dIS/dt= -100 A/µs; VGS =0V;
VDS =25V; Tj =25°C
-50 - ns recovered charge - 65 - nC
NXP Semiconductors PHP29N08T
N-channel TrenchMOS standard level FET
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