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PMBTA42NXP/PHILIPSN/a3000avai300 V, 100 mA NPN high-voltage transistor


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PMBTA42
300 V, 100 mA NPN high-voltage transistor
Product profile1.1 General description
NPN high-voltage transistor in a small SOT23 (TO-236AB) Surface-Mounted
Device (SMD) plastic package.
PNP complement: PMBTA92.
1.2 Features
High voltage (max. 300V)
1.3 Applications
T elephony and professional communication equipment
1.4 Quick reference data
Pinning information
PMBT A42
300 V, 100 mA NPN high-voltage transistor
Rev. 05 — 12 December 2008 Product data sheet
Table 1. Quick reference data

VCEO collector-emitter voltage open base - - 300 V collector current - - 100 mA
hFE DC current gain VCE =10V =1 mA 25 - - =10 mA 40 - - =30 mA 40 - -
Table 2. Pinning
base emitter
3collector
NXP Semiconductors PMBTA42
300 V, 100 mA NPN high-voltage transistor Ordering information

[1] /DG: halogen-free Marking
[1] /DG: halogen-free
[2] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Table 3. Ordering information

PMBTA42 - plastic surface-mounted package; 3 leads SOT23
PMBTA42/DG
Table 4. Marking codes

PMBTA42 *1D
PMBTA42/DG *BV
Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VCBO collector-base voltage open emitter - 300 V
VCEO collector-emitter voltage open base - 300 V
VEBO emitter-base voltage open collector - 6 V collector current - 100 mA
ICM peak collector current single pulse; ≤ 1ms
-200 mA
IBM peak base current single pulse; ≤ 1ms
-100 mA
Ptot total power dissipation Tamb≤25°C [1] -250 mW junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
NXP Semiconductors PMBTA42
300 V, 100 mA NPN high-voltage transistor Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Characteristics
Table 6. Thermal characteristics

Rth(j-a) thermal resistance from
junction to ambient
in free air [1]- - 500 K/W
Table 7. Characteristics

Tamb =25 °C unless otherwise specified.
ICBO collector-base cut-off
current
VCB =200 V; IE=0A - - 100 nA
IEBO emitter-base cut-off
current
VEB =6 V; IC=0A - - 100 nA
hFE DC current gain VCE =10V =1 mA 25 - - =10mA 40 - - =30mA 40 - -
VCEsat collector-emitter
saturation voltage =20mA; IB=2 mA - - 500 mV
VBEsat base-emitter saturation
voltage =20mA; IB=2 mA - - 900 mV
Cre feedback capacitance VCB =20 V; IC =ic =0A; 1MHz
--3 pF transition frequency VCE =20 V; IC =10mA; 100MHz --MHz
NXP Semiconductors PMBTA42
300 V, 100 mA NPN high-voltage transistor Package outline

Fig 1. Package outline SOT23 (TO-236AB)
NXP Semiconductors PMBTA42
300 V, 100 mA NPN high-voltage transistor Packing information

[1] For further information and the availability of packing methods, see Section13.
[2] /DG: halogen-free
10. Soldering

Table 8. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]
PMBTA42 SOT23 4 mm pitch, 8 mm tape and reel -215 -235
PMBTA42/DG
NXP Semiconductors PMBTA42
300 V, 100 mA NPN high-voltage transistor

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