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PRTR5V0U4AD
Integrated quad ultra-low capacitance ESD protection
Product profile1.1 General descriptionThe PRTR5V0U4AD is designed to protect Input/Output (I/O) ports that are sensitive
concerning capacitive load, such as USB 2.0, Ethernet, Digital Video Interface (DVI), etc.
from destructionby ElectroStatic Discharges (ESD).It provides protectionto downstream
signal and supply components from ESD voltages as high as ±8 kV (contact discharge).
The PRTR5V0U4AD incorporates four pairs of ultra-low capacitance rail-to-rail diodes
plus an additional Zener diode. The rail-to-rail diodes are connected to the Zener diode
which allows ESD protection to be independent of the availability of a supply voltage.
The PRTR5V0U4AD is fabricated using thin film-on-silicon technology integrating four
ultra-low capacitance rail-to-rail ESD protection diodes in a miniature 6-lead SOT457
package.
1.2 Features ESD protection compliant to IEC 61000-4-2 level 4,±8 kV contact discharge Low voltage clamping due to integrated Zener diode Four ultra-low input capacitance (1 pF typical) rail-to-rail ESD protection diodes Small 6-lead SOT457 package
1.3 Applications General-purpose downstream ESD protection of high frequency analog signals and
high-speed serial data transmission for ports inside: Cellular mobile handsets USB 2.0 and IEEE 1394 ports in PC or notebook Interfaces: DVI and High Definition Multimedia Interface (HDMI) Cordless telephones Wireless data systems: Wide Area Network (WAN) and Local Area Network (LAN) Personal Digital Assistants (PDAs)
PRTR5V0U4AD
Integrated quad ultra-low capacitance ESD protection
Rev. 01 — 17 December 2007 Product data sheet
NXP Semiconductors PRTR5V0U4AD
Integrated quad ultra-low capacitance ESD protection Pinning information Ordering information Limiting values Recommended operating conditions
Table 1. Pinning ESD protection I/O 1 supply voltage (VCC) ESD protection I/O 2 ESD protection I/O 3 ground (GND) ESD protection I/O 4
001aah445
Table 2. Ordering informationPRTR5V0U4AD TSOP6 plastic surface-mounted package (TSOP6); 6 leads SOT457
Table 3. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). input voltage 0 5.5 V
Vesd electrostatic discharge
voltage
all pins; IEC 61000-4-2 level4
contact discharge −8+8 kV
air discharge −15 +15 kV
Tstg storage temperature −55 +125 °C
Table 4. Operating conditionsTamb ambient temperature −40 - +85 °C
NXP Semiconductors PRTR5V0U4AD
Integrated quad ultra-low capacitance ESD protection Characteristics[1] Measured from pins 1, 3, 4 and 6 to ground (GND).
[2] Measured from pin 2 to ground (GND).
Application informationThe PRTR5V0U4AD is optimized to protect e.g. two USB 2.0 ports against ESD. Each
device is capable to protect both USB data lines and the VBUS supply.
A typical application is shown in Figure1.
Table 5. CharacteristicsTamb =25 °C unless otherwise specified.
C(I/O-GND) input/output to ground
capacitance
V(I/O-GND) = 0 V;
VCC= 3.0V;
f=1MHz
[1]- 1.0 - pF
ILR reverse leakage current V(I/O-GND) = 3.0 V [1]- - 100 nA
VBR breakdown voltage II = 1 mA 6 - 9 V
Csup supply pin to ground
capacitance
V(I/O-GND) = 0 V;
VCC= 3.0V;
f=1MHz
[2] -40 - pF forward voltage - 0.7 - V
NXP Semiconductors PRTR5V0U4AD
Integrated quad ultra-low capacitance ESD protection Package outline
Fig 2. Package outline SOT457 (TSOP6)
Plastic surface-mounted package (TSOP6); 6 leads SOT457
NXP Semiconductors PRTR5V0U4AD
Integrated quad ultra-low capacitance ESD protection Revision history
Table 6. Revision historyPRTR5V0U4AD_1 20071217 Product data sheet - -
NXP Semiconductors PRTR5V0U4AD
Integrated quad ultra-low capacitance ESD protection
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[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The productstatus ofdevice(s) describedinthis documentmayhavechanged since thisdocumentwaspublishedandmay differincase ofmultiple devices.The latest productstatus
information is available on the Internet at URL http://.
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withthe same product type number(s)andtitle. Ashort data sheetis intended
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full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
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full data sheet shall prevail.
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changes to information published in this document, including without
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malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
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specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings Systemof IEC60134) may cause permanent
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the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
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Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
