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PRTR5V0U4DNXPN/a30000avaiUltra low capacitance quadruple rail-to-rail ESD protection


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PRTR5V0U4D
Ultra low capacitance quadruple rail-to-rail ESD protection
1. Product profile
1.1 General description

Ultra low capacitance quadruple rail-to-rail ElectroStatic Discharge (ESD) protection
device in an SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package.
The device is designed to protect four high-speed data lines or high-frequency signal lines
from the damage caused by ESD and other transients.
PRTR5V0U4D integrates four ultra low capacitance rail-to-rail ESD protection channels
and one additional ESD protection diode to ensure signal line protection even if no supply
voltage is available.
1.2 Features and benefits
ESD protection of four high-speed data lines or high-frequency signal lines Ultra low input/output to ground capacitance: C(I/O-GND) =1pF ESD protection up to 8 kV IEC 61000-4-2, level 4 (ESD) Very low clamping voltage due to an integrated additional ESD protection diode Very low reverse current AEC-Q101 qualified Small SMD plastic package
1.3 Applications
USB 2.0 interfaces Digital Video Interface (DVI) High-Definition Multimedia Interface (HDMI) Mobile phones Digital cameras WAN/LAN systems PC, notebooks, printers and other PC peripherals
PRTR5V0U4D
Ultra low capacitance quadruple rail-to-rail ESD protection
Rev. 2 — 5 March 2012 Product data sheet
NXP Semiconductors PRTR5V0U4D
Ultra low capacitance quadruple rail-to-rail ESD protection
1.4 Quick reference data

[1] Measured from pins 1, 3, 4 and 6 to pin 2.
[2] Measured from pin 5 to pin 2.
2. Pinning information

3. Ordering information

4. Marking

Table 1. Quick reference data

Tamb =25 C unless otherwise specified.
Per channel

C(I/O-GND) input/output to ground
capacitance
V(I/O-GND) =0V;
VCC =3V;
f=1MHz
[1] -1.0 -pF
Zener diode
input voltage 0 - 5.5 V
Csup supply pin to ground
capacitance
V(I/O-GND) =0V;
VCC =3V;
f=1MHz
[2] -40 -pF
Table 2. Pinning
Table 3. Ordering information

PRTR5V0U4D SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457
Table 4. Marking code

PRTR5V0U4D 4D
NXP Semiconductors PRTR5V0U4D
Ultra low capacitance quadruple rail-to-rail ESD protection
5. Limiting values

[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1, 3, 4 or 6 to pin 2 or 5.
Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
Per device
junction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
Table 6. ESD maximum ratings

Tamb =25 C unless otherwise specified.
Per channel

VESD electrostatic discharge
voltage
IEC 61000-4-2
(contact discharge)
[1][2] -8 kV
MIL-STD-883
(human body model) kV
Table 7. ESD standards compliance
Per channel

IEC 61000-4-2; level4 (ESD) >8kV (contact)
MIL-STD-883; class3B (human body model) >8kV
NXP Semiconductors PRTR5V0U4D
Ultra low capacitance quadruple rail-to-rail ESD protection
6. Characteristics

[1] Measured from pins 1, 3, 4 and 6 to pin 2.
[2] Measured from pin 5 to pin 2.
7. Application information

The device is designed for the protection of for example, two USB 2.0 ports against ESD.
Each device is capable to protect both, USB data lines and the VBUS supply.
8. Test information
8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Table 8. Characteristics

Tamb =25 C unless otherwise specified.
Per channel

IRM reverse leakage current VR =3V [1]- - 100 nA
C(I/O-GND) input/output to ground
capacitance
V(I/O-GND) =0V;
VCC =3V; f= 1MHz
[1] -1.0 -pF forward voltage - 0.7 - V
Zener diode
input voltage 0 - 5.5 V
VBR breakdown voltage II=1 mA 6- 9V
Csup supply pin to ground
capacitance
V(I/O-GND) =0V;
VCC =3V; f= 1MHz
[2] -40 -pF
NXP Semiconductors PRTR5V0U4D
Ultra low capacitance quadruple rail-to-rail ESD protection
9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section14.
[2] T1: normal taping
[3] T2: reverse taping
Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]
PRTR5V0U4D SOT457 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 mm pitch, 8 mm tape and reel; T2 [3] -125 -165
NXP Semiconductors PRTR5V0U4D
Ultra low capacitance quadruple rail-to-rail ESD protection
11. Soldering

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