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FXLH42245 from FSC,Fairchild Semiconductor

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FXLH42245

Manufacturer: FSC

Low Voltage Dual Supply 8-Bit Signal Translator with Configurable Voltage Supplies and Bushold Data Inputs and 3-STATE and 26 Ohm ...

Partnumber Manufacturer Quantity Availability
FXLH42245 FSC 7500 In Stock

Description and Introduction

Low Voltage Dual Supply 8-Bit Signal Translator with Configurable Voltage Supplies and Bushold Data Inputs and 3-STATE and 26 Ohm ... Part number **FXLH42245** is manufactured by **Fairchild Semiconductor (now part of ON Semiconductor)**.  

### **FSC (Federal Supply Class) Specifications**:  
- **FSC Code**: 5962 (Semiconductor Devices)  
- **Description**: This part is a **Radiation-Hardened (RHA) Dual 4-Bit D-Type Flip-Flop with Clear**, designed for high-reliability applications, including aerospace and defense.  
- **Qualification**: Qualified to **MIL-PRF-38535** for radiation-hardened applications.  
- **Temperature Range**: **-55°C to +125°C** (military-grade).  
- **Packaging**: Available in **hermetic ceramic packages** (e.g., 20-pin CerDIP or LCC).  

For exact military or space-level specifications, refer to the **MIL-PRF-38535** certification documents or the manufacturer's datasheet.

Application Scenarios & Design Considerations

Low Voltage Dual Supply 8-Bit Signal Translator with Configurable Voltage Supplies and Bushold Data Inputs and 3-STATE and 26 Ohm ...# Technical Documentation: FXLH42245 High-Speed Differential Line Driver

 Manufacturer : FSC (Fairchild Semiconductor)
 Component Type : High-Speed Differential Line Driver
 Document Version : 1.0
 Date : October 26, 2023

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## 1. Application Scenarios

### 1.1 Typical Use Cases
The FXLH42245 is a high-performance differential line driver designed for applications requiring robust signal transmission over controlled impedance media. Its primary function is to convert single-ended TTL/CMOS logic signals into low-voltage differential signaling (LVDS) pairs, enabling high-speed data transmission with superior noise immunity.

 Key operational contexts include: 
*    Clock Distribution:  Transmitting high-frequency clock signals (typically up to 400+ MHz) from a source to multiple endpoints across a backplane or board with minimal skew and jitter.
*    Point-to-Point Data Links:  Establishing a reliable serial data channel between two PCBs or subsystems, such as between a sensor interface card and a central processor.
*    Multidrop Buses:  While primarily optimized for point-to-point, it can be configured in carefully designed multidrop arrangements for broadcasting data to several receivers.

### 1.2 Industry Applications
This component finds extensive use in industries where signal integrity and speed are paramount.

*    Telecommunications & Networking:  Used in router and switch backplanes, base station equipment, and network interface cards for distributing synchronization clocks and high-speed control/data signals.
*    Test & Measurement Equipment:  Critical for high-bandwidth oscilloscopes, logic analyzers, and automated test equipment (ATE) where precise timing and clean signal transmission between modules are essential.
*    Industrial Automation:  Employed in motion control systems, high-speed PLCs, and vision inspection systems to transmit data across noisy factory environments.
*    Computing & Data Storage:  Applicable in server backplanes, RAID controllers, and high-performance computing clusters for inter-board communication.
*    Medical Imaging:  Used in ultrasound, CT, and MRI systems for transmitting digitized sensor data from acquisition modules to processing units.

### 1.3 Practical Advantages and Limitations

 Advantages: 
*    High Noise Immunity:  Differential signaling inherently rejects common-mode noise, making it ideal for electrically noisy environments.
*    Low EMI Generation:  The opposing currents in the differential pair result in canceling magnetic fields, reducing electromagnetic interference.
*    Low Power Consumption:  Operates from a single 3.3V supply with a typical current consumption significantly lower than older technologies like PECL.
*    High Speed:  Supports data rates suitable for fast serial interfaces and clock distribution well into the hundreds of MHz.
*    Integrated Termination:  Simplifies design by providing a 100Ω termination resistor option between the differential outputs.

 Limitations: 
*    Point-to-Point Focus:  While possible, creating robust multidrop buses requires careful stub length management and may limit maximum data rate.
*    PCB Real Estate:  Requires a controlled impedance differential pair on the PCB, which consumes more board space and adds layer count complexity compared to single-ended traces.
*    Power Sequencing:  Like many high-speed ICs, careful attention must be paid to power supply sequencing relative to input signals to prevent latch-up or excessive current draw.
*    ESD Sensitivity:  High-speed I/O pins are susceptible to electrostatic discharge; proper handling and board-level ESD protection are necessary.

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## 2. Design Considerations

### 2.1 Common Design Pitfalls and Solutions
| Pitfall | Consequence | Solution |
| :--- | :--- | :--- |
|  Improper Impedance Matching  | Signal reflections, overshoot/undershoot, degraded eye diagram, increased bit error rate (BER). | Ensure differential trace impedance is 100Ω (±10%). Use a controlled impedance stack-up and

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