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XCV600E-6FG680I from XILINX

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XCV600E-6FG680I

Manufacturer: XILINX

Virtex-E 1.8V field programmable gate array.

Partnumber Manufacturer Quantity Availability
XCV600E-6FG680I,XCV600E6FG680I XILINX 15 In Stock

Description and Introduction

Virtex-E 1.8V field programmable gate array. The **XCV600E-6FG680I** is a field-programmable gate array (FPGA) manufactured by **Xilinx**. Below are the factual specifications, descriptions, and features based on available information:

### **Specifications:**
- **Manufacturer:** Xilinx  
- **Series:** Virtex-E  
- **Part Number:** XCV600E-6FG680I  
- **Device Type:** FPGA  
- **Logic Elements/Cells:** 600,000 system gates  
- **Number of Logic Blocks (CLBs):** 1,728 (configurable logic blocks)  
- **Number of I/Os:** 404 (user I/O pins)  
- **Operating Voltage:** 2.5V (core), 3.3V (I/O)  
- **Speed Grade:** -6 (performance grade)  
- **Package Type:** 680-pin Fine-Pitch Ball Grid Array (FG680)  
- **Operating Temperature Range:** Industrial (-40°C to +100°C)  
- **On-Chip RAM:** 288 Kbits (distributed and block RAM)  
- **Maximum Frequency:** Varies based on design and configuration  

### **Descriptions:**
- The **XCV600E-6FG680I** is part of Xilinx’s **Virtex-E** family, designed for high-performance digital logic applications.  
- It features a **modular architecture** with configurable logic blocks (CLBs), block RAM, and flexible I/O support.  
- The **FG680 package** provides high-density interconnects for complex designs.  
- Suitable for **telecommunications, networking, and high-speed data processing** applications.  

### **Features:**
- **High Logic Density:** 600K system gates for complex designs.  
- **Flexible I/O Support:** Supports multiple I/O standards (LVTTL, LVCMOS, PCI, etc.).  
- **On-Chip Memory:** Includes block RAM for data storage.  
- **Dedicated Clock Management:** Digital Clock Managers (DCMs) for precise timing.  
- **Partial Reconfiguration:** Allows dynamic updates to parts of the FPGA.  
- **Industrial Temperature Range:** Operates reliably in harsh environments.  
- **Fine-Pitch BGA Packaging:** Optimized for high-speed signal integrity.  

This information is based on Xilinx’s official documentation for the **Virtex-E** series. For exact performance metrics and timing details, refer to the datasheet or technical reference manual.

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