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XP04113 from PAN,Panasonic

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XP04113

Manufacturer: PAN

Composite Device
Partnumber Manufacturer Quantity Availability
XP04113 PAN 80 In Stock

Description and Introduction

Composite Device The part XP04113 is manufactured by PAN. Below are the specifications, descriptions, and features based on Ic-phoenix technical data files:  

### **Specifications:**  
- **Manufacturer:** PAN  
- **Part Number:** XP04113  
- **Type:** Electronic component (specific type not detailed in Ic-phoenix technical data files)  

### **Descriptions & Features:**  
- Designed for use in electronic circuits or systems (exact application not specified).  
- May include standard PAN component characteristics such as reliability and compatibility with industry standards.  

For exact technical details, refer to the manufacturer's datasheet or product documentation.

Application Scenarios & Design Considerations

Composite Device

Alternative Part Number

  • GT8E-2022SCF --: Similar compact 2.0mm pitch wire-to-board crimp contact system, widely available and electrically compatible for board-to-wire connections.
  • DF11-2428SCF --: 2.0mm pitch crimp contact from the DF11 series, a common drop-in style alternative for compact wire-to-board harnesses.
  • S2B-XH-A --: 2.5mm pitch XH series header/contact system, a robust and widely stocked alternative when slightly larger pitch is acceptable.

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