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EMIF02-SPK02F2 |EMIF02SPK02F2STN/a4498avai2-line IPAD™ EMIF filter and ESD protection


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EMIF02-SPK02F2
2-line IPAD™ EMIF filter and ESD protection
April 2012 Doc ID 15035 Rev 3 1/12
EMIF02-SPK02F2

2-line IP AD™, EMI filter and ESD protection
Datasheet − production data
Features
Packaged in lead-free Flip Chip Very low resistance: 0.35 Ω High attenuation: -45 dB at 900 MHz Very low PCB space consumption:
0.89 mm x 1.26 mm Very thin package: 0.65 mm High efficiency in ESD suppression
IEC6 1000-4-2 level 4 High reliability offered by monolithic integration High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
IEC 61000-4-2 level 4: ±15 kV (air discharge) ±8 kV (contact discharge)
Application
Mobile phones
Description

The EMIF02-SPK02F2 chip is a highly integrated
device designed to suppress EMI/RFI noise for
interface line filtering.
The EMIF02-SPK02F2 flip-chip packaging means
the package size is equal to the die size. That's
why the EMIF02-SPK02F2 is a very small device.
Additionally, this filter includes ESD protection
circuitry, which prevents damage to the protected
device when subjected to ESD surges up 30 kV.

Figure 1. Pin configuration (bump side)
Figure 2. Functional schematic
TM: IPAD is a trademark of STMicroelectronics
Characteristics EMIF02-SPK02F2
2/12 Doc ID 15035 Rev 3
1 Characteristics


Figure 3. Electrical characteristics - definitions
Table 2. Electrical characteristics - values (Tamb = 25 °C)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
EMIF02-SPK02F2 Characteristics
Doc ID 15035 Rev 3 3/12
Figure 4. Attenuation measurements versus frequency
Figure 5. Crosstalk measurements versus frequency
Characteristics EMIF02-SPK02F2
4/12 Doc ID 15035 Rev 3
Figure 6. ESD test conditions
Figure 7. Clamping voltage VCL versus peak pulse current IPP for short pulse duration such as
ESD surges

Note: For further information on the dynamic characteristic see the STMicroelectronics’
application note AN4022, “TVS short pulse Rd measurement and correlation with TVS
clamping voltage during ESD”.
EMIF02-SPK02F2 Characteristics
Doc ID 15035 Rev 3 5/12
Figure 8. Output filter ESD response to IEC 61000-4-2 (+8 kV contact discharge) I1 to O1
Figure 9. Output filter ESD response to IEC 61000-4-2 (-8 kV contact discharge) I1 to O1
Characteristics EMIF02-SPK02F2
6/12 Doc ID 15035 Rev 3
Figure 10. Output filter ESD response to IEC 61000-4-2 (+15 kV contact discharge) I1 to O1
Figure 11. Output filter ESD response to IEC 61000-4-2 (-15 kV contact discharge) I1 to O1
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