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EMIF03-SIM02M8 |EMIF03SIM02M8STN/a200avai3-line EMI filter and ESD protection for SIM card interfaces


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EMIF03-SIM02M8
3-line EMI filter and ESD protection for SIM card interfaces
October 2007 Rev 1 1/10
EMIF03-SIM02M8

3 line IP AD™, EMI filter for SIM card applications
Features
SIM card EMI low-pass filter High efficiency in EMI filtering Very low PCB space consumption:
1.7 mm x 1.5 mm Very thin package: 0.6 mm max High efficiency in ESD suppression on external
pins (IEC 61000-4-2 level 4). High reliability offered by monolithic integration High reduction of parasitic elements through
integration and wafer level packaging. Lead free package Easy layout and flexibility thanks to I/O
topology Low clamping voltage
Complies with following standards
IEC 61000-4-2 level 4 external pins 15 kV (air discharge) 8 kV (contact discharge) IEC 61000-4-2 level 2 internal pins 2 kV (air discharge) 2 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3A (all
pins)
Applications

Where EMI filtering in ESD sensitive equipment is
required: Keyboard for mobile phones Computers and printers Communication systems MCU boards
TM: IPAD is a trademark of STMicroelectronics
Figure 1. Pin configuration (top view)
Figure 2. Device configuration
Description

The EMIF03-SIM02M8 is a 3 line highly
integrated device designed to suppress EMI/RFI
noise in all systems exposed to electromagnetic
interference.
This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up to 15 kV on the
external pins.
Characteristics EMIF03-SIM02M8
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1 Characteristics



Table 1. Absolute ratings (limiting values at Tamb = 25 °C unless otherwise specified)
Table 2. Electrical characteristics (Tamb = 25 °C)
EMIF03-SIM02M8 Characteristics
3/10



Figure 3. S21(db) attenuation (RST line) Figure 4. S21(db) attenuation (CLK line)
Figure 5. S21(db) attenuation (DATA line) Figure 6. Analog cross talk measurements
Figure 7. ESD response to IEC 61000-4-2
(+15 kV air discharge) applied to
external pin
Figure 8. ESD response to IEC 61000-4-2
(-15 kV air discharge) applied to
external pin
Application schematic EMIF03-SIM02M8
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2 Application schematic
Figure 11. Application schematic Ordering information scheme
Figure 12. Ordering information scheme
Figure 9. ESD response to IEC 61000-4-2
(+2 kV air discharge) applied to
internal pin
Figure 10. ESD response to IEC 61000-4-2
(-2 kV air discharge) applied to
internal pin
EMIF03-SIM02M8 Package information
5/10
4 Package information
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOP ACK is an ST trademark. ECOPACK specifications are available
at: .


Table 3. QFN 1.7 x 1.5 package dimensions
Figure 13. Footprint (dimensions in mm) Figure 14. Marking
Package information EMIF03-SIM02M8
6/10
Figure 15. Tape and reel specification

Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
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