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ESDALC6V1M3
DUAL LOW CAPACITANCE TRANSIL ARRAY FOR ESD PROTECTION
October 2010 Doc ID 11555 Rev 5 1/12
ESDALC6V1M3Dual low capacitance T ransil™ array for ESD protection
Features 2 unidirectional, low capacitance Transil diodes Better than IEC 61000-4-2 standard (ESD
protection: 11 kV contact discharge) Breakdown voltage VBR = 6.1 V min Low diode capacitance (11 pF typ at 0 V) Low leakage current < 0.5 µA Very small PCB area: 0.6 mm2 RoHS compliant
Benefits High ESD protection level High integration Suitable for high density boards
Complies with the following standards IEC61000-4-2 level 4: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G-Method 3015-7: class 3B: HBM (human body model)
ApplicationsWhere transient overvoltage protection in ESD
sensitive equipment is required, such as: Computers Printers Communication systems Cellular phone handsets and accessories Video equipment
Figure 1. Functional diagram
DescriptionThe ESDALC6V1M3 is a monolithic array
designed to protect 1 line or 2 lines against ESD
transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required.
TM: Transil is a trademark of STMicroelectronics
Characteristics ESDALC6V1M32/12 Doc ID 11555 Rev 5
1 Characteristics
Figure 2. Electrical characteristics (definitions)
Table 1. Absolute ratings (Tamb = 25 °C) For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2. Electrical characteristics (T amb = 25 °C)
ESDALC6V1M3 CharacteristicsDoc ID 11555 Rev 5 3/12
Figure 3. Relative variation of peak pulse
power versus initial junction
temperature
Figure 4. Peak pulse power versus
exponential pulse duration
Figure 5. Clamping voltage versus peak
pulse current (typical values)
Figure 6. Forward voltage drop versus peak
forward current (typical values)
Figure 7. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 8. Variation of leakage current versus
junction temperature
(typical values)
Characteristics ESDALC6V1M34/12 Doc ID 11555 Rev 5
Figure 9. ESD response to IEC61000-4-2
(+15 kV air discharge) on each
channel
Figure 10. ESD response to IEC61000-4-2
(-15 kV air discharge) on each
channel
Figure 11. S21 attenuation measurement
results of each channel
Figure 12. Analog crosstalk measurements
between channels
ESDALC6V1M3 Ordering informationDoc ID 11555 Rev 5 5/12
2 Ordering information
Figure 13. Ordering information scheme
Package information ESDALC6V1M36/12 Doc ID 11555 Rev 5
3 Package information Epoxy meets UL94, V0 Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin1
mark is to be used for this purpose.
Table 3. SOT883 dimensions
Figure 14. Footprint Figure 15. Marking
