ESDAVLC8-4BN4 ,4-line very low capacitance Transil™ array for ESD protectionApplicationsWhere transient overvoltage protection and electrical overstress protection in sensitiv ..
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ESDAVLC8-4BN4
4-line very low capacitance Transil™ array for ESD protection
March 2014 DocID022192 Rev 3 1/10
ESDA VLC8-4BN44-line very low capacitance Transil™ array for ESD protection
Datasheet − production data
Figure 1. Functional diagram (top view)
Features Stand-off voltage: 3 V Very low capacitance: 4.5 pF Small package: 1.0 x 0.8 mm Very thin package: 0.40 mm max Low leakage current: 50 nA at 25 °C
Benefits High ESD robustness of the equipment Suitable for high speed interface
Complies with the following standards: IEC 61000-4-2: ±15 kV (air discharge) ±8 kV (contact discharge) MIL STD 883G- Method 3015-7: class3B: >25 kV (human body model)
ApplicationsWhere transient overvoltage protection and
electrical overstress protection in sensitive
equipment is required, such as: Communication systems Cellular phone handsets and accessories Video equipment
DescriptionThe ESDAVLC8-4BN4 is monolithic array
designed to protect up to 4 lines against ESD
transients. It has been designed specifically for
the protection of the high speed interface of
integrated circuits in portable equipment and
miniaturized electronics devices. The µQFN-4L
package minimizes PCB space.
TM: Transil is a trademark of STMicroelectronics.
Characteristics ESDAVLC8-4BN4 DocID022192 Rev 3
1 Characteristics
Figure 2. Electrical characteristics (definitions) Note: For component test in its final application, the minimum clamping voltage has to be 20 V on
VBR1 (GND to I/O) and 25 V on VBR2 (I/O to GND).
Table 1. Absolute maximum ratings (Tamb = 25 °C) For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2. Electrical characteristics (values, Tamb = 25 °C)
DocID022192 Rev 3 3/10
ESDAVLC8-4BN4 Characteristics
Figure 3. Peak pulse power versus initial
junction temperature (8/20 µs waveform)
Figure 4. Peak pulse power versus exponential
pulse duration
Figure 5. Clamping voltage versus peak pulse
current (typical values, 8/20 µs waveform)
Figure 6. Junction capacitance versus reverse
voltage applied (typical values)
Figure 7. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on each channel
Figure 8. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on each channel
Characteristics ESDAVLC8-4BN4 DocID022192 Rev 3
Figure 9. S21 attenuation measurement Figure 10. Analog crosstalk measurement
Figure 11. Leakage current versus junction
temperature (typical values)
Figure 12. TLP measurement
DocID022192 Rev 3 5/10
ESDAVLC8-4BN4 Package information
2 Package information Epoxy meets UL94, V0 Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Figure 13. µQFN-4L dimension definitions Table 3. µQFN-4L dimension values
Package information ESDAVLC8-4BN4
6/10 DocID022192 Rev 3
Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
Figure 16. Tape and reel specifications
Figure 14. Footprint dimensions (in mm) Figure 15. Marking
