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IR2161PBF
Halogen Converter Control IC
Data Sheet No. PD60219 rev C
Internet onol
TOR Rectifier IR2161(S) & (PbF)
HALOGEN CONVERTOR CONTROL IC
Features Packages
. Intelligent half-bridge driver
0 Auto Resetting Short Circuit Protection
. Auto Resetting Overload Protection
. Externally Triggerable Latching Shutdown
0 Latching Overtemperature Protection
q Frequency Modulation "dither" (for lower EMI)
. Micropower Startup (<300 pA)
q Phase Cut dimmable for leading /trailing edge
. Output Voltage Shift Compensation.
q Real Softstart
. Adaptive Dead Time
q Small 8 Pin DIP/SOIC Package
. Also available LEAD-FREE (PbF)
Description
The IR2161 is a dedicated Intelligent Half bridge Driver IC for a Halogen convertor (electronic transformer). It
includes all necessary protection features and also allows the Convertor to be dimmed externally with a
standard phase cut dimmer with both leading or trailing edge types. This IC provides the advantage of reduced
thermal stress in the lamp due to softstart. There is also compensation of the output voltage for load regulation.
It enables the convertor to operate with extremely low harmonic distortion over the full range of loads. The
IR2161 includes adaptive deadtime to allow cool running MOSFETs and improves the EMI behaviour due to
frequency modulation (dither). All the features are integrated in a small 8 pin DlP/SOIC package to allow for a
size reduction in the next generation of convertors.
8-Lead SOIC
8-Lead PDIP IR2161S
IR2161
Typical Connections
g RS R1 g = CI
C rm CVCCIF
AC LINE = CLF T1
0 vzii c3 C4
031 m 't(: " = c2
= CSD = CCS RCS s' 12VAC
OUTPUT
Note: Throughout this data sheet "convertor" is spelled in accordance with standard IEC 61047 "DC or AC supplied converters
for filament lamps - Performance requirements".
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IR2161(S)&(PbF) International
TOR Rectifier
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters
are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power
dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
VB High side floating supply voltage -O.3 625
Vs High side floating supply offset voltage VB - 25 VB + 0.3 V
VH0 High side floating output voltage Vs - 0.3 VB + 0.3
VLo Low side output voltage -0.3 Vcc + 0.3
IOMAx Maximum allowable output current (HO,LO) due to external -500 500 mA
power transistor miller effect
VCSDMAX CSD pin voltage -O.3 VCC + 0.3
VCS Current sense pin voltage -0.3 VCC +0.3 V
Ics Current sense pin current -5 5
Ice Supply current (Note 1) -20 20 mA
dV/dt Allowable offset voltage slew rate -50 50 V/ns
PD Maximum power dissipation @ TA f +25°C (8 Lead DIP) - 1
PD = (TJMAx-TA)/RthJA (8 Lead SOIC) - 0.625 W
RthJA Thermal resistance, junction to ambient (8 Lead DIP) - 125 "C/W
(8 Lead SOIC) - 200
TJ Junction temperature -55 150
Ts Storage temperature -55 150 "C
TL Lead temperature (soldering, 10 seconds) - 300
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Symbol Definition Min. Max. Units
VBS High side floating supply voltage VCC - 0.7 VCLAMP
VBSMIN Minimum required VBS voltage for proper HO functionality 4.3 -
Vs Steady state high-side floating supply offset voltage -1 600 V
Vcc Supply voltage Vccuw VCLAMP
ICC Supply current (Note 2) 10 mA
CSD CSD pin external capacitor 47 - nF
Ics Current sense pin current -1 1 mA
TJ Junction temperature -25 125 ''C
Note I: This IC contains a zener clamp structure between the chip VCC and COM which has a nominal breakdown
voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source
greater than the VCLAMP specified in the Electrical Characteristics section.
Note 2: Enough current should be supplied into the Vcc pin to keep the internal 15.6V zener clamp diode on this pin
regulating its voltage, VCLAMP.
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