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PAL16R4A-2MJB |PAL16R4A2MJBTI?N/a500avai2M


PAL16R4A-2MJB ,2M PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2MPAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2MSTAND ..
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PAL16R4A-2MJB
2M
PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M
PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M
STANDARD HIGH-SPEED PAL
CIRCUITS
SRPS016 – D2705, FEBRUARY 1984 – REVISED MARCH 1992 Choice of Operating Speeds
High-Speed, A Devices ... 25 MHz Min
Half-Power, A-2 Devices ... 16 MHz Min
Choice of Input/Output Configuration Package Options Include Both Ceramic DIP
and Chip Carrier in Addition to Ceramic
Flat Package

description
These programmable array logic devices feature
high speed and a choice of either standard or
half-power devices. They combine Advanced
Low-Power Schottky technology with proven
titanium-tungsten fuses. These devices will
provide reliable, high-performance substitutes for
conventional TTL logic. Their easy
programmability allow for quick design of ”custom”
functions and typically results in a more compact
circuit board. In addition, chip carriers are
available for further reduction in board space.
The Half-Power versions offer a choice of
operating frequency, switching speeds, and
power dissipation. In many cases, these
Half-Power devices can result in significant power
reduction from an overall system level.
The PAL16’ M series is characterized for
operation over the full military temperature range
of –55°C to 125°C.
GNDCC
I/O
I/O
I/O
I/O
I/O
I/O
PAL16L8’
J OR W PACKAGE
(TOP VIEW)
21 2019
I/O
I/O
I/O
I/O
I/O
PAL16L8’
FK PACKAGE
(TOP VIEW)
II
I/O
GND
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