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STPS1L30MF
Low drop power Schottky rectifier in flat package
August 2006 Rev 1 1/7
STPS1L30MFLow drop power Schottky rectifier in flat package
Main product characteristics
Features and benefits Very low profile package: 0.85 mm Backward compatible with standard STmite
footprint Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop for higher efficiency
and extended battery life Low thermal resistance Avalanche capability specified
Order Code
DescriptionSingle Schottky rectifier suited for switch mode
power supplies and high frequency DC to DC
converters.
Packaged in STmite flat, this device is intended
for use in very low voltage, high frequency
inverters, free wheeling and polarity protection
applications. Due to the very small size of the
package this device fits battery powered
equipment (cellular, notebook, PDA’s, printers) as
well as chargers and PCMCIA cards.
Table 1. Absolute ratings (limiting values) condition to avoid thermal runaway for a diode on its own heatsinkdPtot
dTj--------------- 1
Rthja–()--------------------------<
Characteristics STPS1L30MF2/7
1 Characteristics To evaluate the conduction losses use the following equation: P = 0.26 x IF(AV) + 0.08 IF2 (RMS)
Table 2. Thermal resistance Mounted with minimum recommended pad size, PC board FR4
Table 3. Static electrical characteristics Pulse test: = 380 µs, δ < 2%
STPS1L30MF Characteristics 3/7
Figure 1. Conduction losses versus average
current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration
Characteristics STPS1L30MF4/7
Figure 7. Reverse leakage currrent versus
reverse voltage applied (typical
values)
Figure 8. Reverse leakage currrent versus
junction temperature (typical
values)
Figure 9. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 10. Forward voltage drop versus
forward current
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu=35 µm, typical values)
STPS1L30MF Package information 5/7
2 Package information
Table 4. STmite flat dimensions
Figure 12. STmite flat recommended footprint (all dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOP ACK is an ST trademark.
ECOP ACK specifications are available at: .
Ordering information STPS1L30MF6/7
3 Ordering information
4 Revision history
