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TLP747TOSN/a2002avaiPhotocoupler


TLP747 ,Photocoupler
TLP747GF ,Photocoupler GaAs Ired & Photo-ThyristorTLP747GF TOSHIBA Photocoupler GaAs Ired & Photo−Thyristor TLP747GF Unit in mmOffice Machine Swit ..
TLP747J ,Photocoupler GaAs Ired & Photo-ThyristorPin Configurations (top view) 7.62mm pich 10.16mm pich standard type TLP×××F type 1 6  Creepage ..
TLP747JF ,Photocoupler GaAs Ired & Photo-ThyristorTLP747JF TOSHIBA Photocoupler GaAs Ired & Photo−Thyristor TLP747JF Unit in mmOffice Machine Swi ..
TLP747JF ,Photocoupler GaAs Ired & Photo-ThyristorTLP747JF TOSHIBA Photocoupler GaAs Ired & Photo−Thyristor TLP747JF Unit in mmOffice Machine Swi ..
TLP748J ,Photocoupler (photothyristor output)Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Forward current I 50 mA FFor ..
TMS320DM335ZCE270 ,Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85 SPRS528C–JULY 2008–REVISED JUNE 20101.2 DescriptionThe DM335 processor is a low-cost, low-power pr ..
TMS320DM355ZCE216 , Digital Media System-on-Chip (DMSoC)
TMS320DM355ZCE216 , Digital Media System-on-Chip (DMSoC)
TMS320DM357ZWT ,Digital Media System-on-Chip (DMSoC) 361-NFBGA • IEEE-1149.1 (JTAG) Boundary- • 0.09-μm/6-Level Cu Metal Process (CMOS)Scan-Compatible• 3.3-V and ..
TMS320DM365 ,DaVinci Digital Media Processor• Hardware 3A statistics collection module• Four 64-Bit General-Purpose Timers (each(H3A) configura ..
TMS320DM365ZCE27 ,DaVinci Digital Media Processor 338-NFBGA 0 to 85features a suite of peripheralssaving developers on system costs.This ARM9-based DM365 device offer ..


TLP747
Photocoupler
TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
TOSHIBA PHOTOCOUPLER
TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES

ATTACHMENT : SPECIFICATIONS FOR VDE0884 OPTION: (D4)
Types : TLP721, TLP721F, TLP733, TLP733F, TLP734, TLP734F, TLP747G, TLP747GF, TLP747J,
TLP747JF
This data sheet refers to black mold-resin devices, TLPxxx (D4xxx, M) that previously has a white-resin mold
and have been changed. When designing new products please use black mold-resin devices.
Type designations for 'Option: (D4)', which are tested under VDE0884 requirements.
Ex. : TLP734F (D4-GR-LF4, M) D4 : VDE0884 option GR : CTR rank name LF4 : standard lead bend name M : black mold-resin devices
Note : Use Toshiba standard type number for safety standard application.
Ex. TLP734(FD4-GR-LF4, M) → TLP734F
VDE0884 ISOLA TION CHARACTERISTICS

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