consists of two diodes in a plastic surface mount # GBAV70 Technical Documentation
*Manufacturer: GTM*
## 1. Application Scenarios
### Typical Use Cases
The GBAV70 is a high-performance silicon rectifier diode primarily employed in:
Power Supply Circuits
- AC-to-DC conversion in switching power supplies
- Freewheeling diode in buck/boost converters
- Output rectification in flyback and forward converters
Voltage Clamping Applications
- Transient voltage suppression in motor drive circuits
- Reverse polarity protection in battery-powered systems
- Snubber circuits for inductive load switching
Signal Demodulation
- AM radio signal detection
- Precision rectification in instrumentation circuits
### Industry Applications
Automotive Electronics
- Alternator rectification systems
- ECU power supply protection
- LED lighting driver circuits
- Battery management systems
Industrial Control Systems
- PLC input/output protection
- Motor drive circuits
- Power distribution units
- UPS systems
Consumer Electronics
- Switching power adapters
- LCD/LED TV power supplies
- Computer peripheral power circuits
- Charging circuits for portable devices
Renewable Energy Systems
- Solar panel bypass diodes
- Wind turbine rectification circuits
- Energy storage system protection
### Practical Advantages and Limitations
Advantages:
- Fast Recovery Time (< 50 ns) enables efficient high-frequency operation
- Low Forward Voltage Drop (typically 0.95V @ 1A) reduces power losses
- High Surge Current Capability (up to 30A) provides robust overload protection
- Compact SMA Package allows for high-density PCB layouts
- Wide Temperature Range (-65°C to +175°C) suitable for harsh environments
Limitations:
- Voltage Rating (70V) may be insufficient for high-voltage applications
- Power Dissipation (1.25W) requires adequate thermal management
- Reverse Recovery Charge can cause switching losses in high-frequency designs
- Package Size limits maximum current handling capability
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Thermal Management Issues
- Pitfall : Inadequate heat sinking leading to thermal runaway
- Solution : Implement proper copper pours and consider external heatsinks for high-current applications
Voltage Spikes and Transients
- Pitfall : Unsuppressed voltage spikes exceeding maximum ratings
- Solution : Incorporate snubber circuits and TVS diodes for protection
Reverse Recovery Effects
- Pitfall : Excessive ringing and EMI due to reverse recovery characteristics
- Solution : Use RC snubbers and optimize switching frequency
### Compatibility Issues
With Microcontrollers
- Ensure logic level compatibility when used in signal detection circuits
- Consider adding level shifting circuits for 3.3V systems
With Power MOSFETs/IGBTs
- Match switching characteristics to prevent timing mismatches
- Consider dead time requirements in bridge configurations
With Capacitors
- Electrolytic capacitors may require current limiting during startup
- Ceramic capacitors help mitigate high-frequency noise
### PCB Layout Recommendations
Power Path Routing
- Use wide traces (minimum 40 mil for 1A current)
- Maintain short return paths to minimize loop inductance
- Implement star grounding for noise-sensitive applications
Thermal Management
- Provide adequate copper area (minimum 100 mm² for full rated current)
- Use thermal vias to distribute heat to inner layers
- Consider exposed pad packages for improved thermal performance
EMI/EMC Considerations
- Keep high-di/dt loops small and tightly coupled
- Place decoupling capacitors close to the diode terminals
- Use ground planes to shield sensitive circuits
Component Placement
- Position diodes close to switching elements
- Maintain adequate clearance for high-voltage nodes
- Consider serviceability
