ultra LOW CAPACITA NCE TVS ARRAY # GBLC24 Technical Documentation
## 1. Application Scenarios
### Typical Use Cases
The GBLC24 transient voltage suppressor (TVS) diode array is primarily employed for ESD protection in high-speed digital interfaces and sensitive electronic circuits. Common applications include:
- USB 2.0/3.0 Port Protection : Provides robust electrostatic discharge protection for data lines (D+/D-) while maintaining signal integrity
- HDMI/DVI Interface Protection : Safeguards TMDS data channels from ESD events up to ±15kV
- Ethernet PHY Protection : Protects RJ-45 interfaces from cable discharge events (CDE) and ESD transients
- Audio/Video Input Protection : Secures analog and digital audio/video inputs from transient overvoltage conditions
### Industry Applications
Consumer Electronics : Smartphones, tablets, laptops, gaming consoles, and digital cameras utilize GBLC24 for interface protection
Automotive Electronics : Infotainment systems, USB charging ports, and communication interfaces in vehicles
Industrial Control Systems : PLC I/O protection, sensor interfaces, and communication ports in harsh environments
Telecommunications : Network equipment, routers, switches, and base station interfaces
### Practical Advantages and Limitations
#### Advantages:
- Low Clamping Voltage : Typically 9V at 5A, providing excellent protection for sensitive ICs
- Low Capacitance : <1.0pF per channel, ensuring minimal signal degradation in high-speed applications
- Bi-directional Protection : Suitable for both positive and negative transient events
- Compact Package : SOT-23-6L package enables high-density PCB layouts
- Fast Response Time : <1ns reaction to ESD events per IEC 61000-4-2 standards
#### Limitations:
- Limited Current Handling : Maximum peak pulse current of 5A (8/20μs)
- Voltage Range : Operating voltage limited to 5V systems
- Thermal Considerations : Requires proper PCB thermal management for repeated ESD events
- Not Suitable for : High-energy surge protection (lightning, inductive load switching)
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: Incorrect Placement
- *Problem*: Placing GBLC24 too far from protected connectors
- *Solution*: Position within 1cm of connector entry point to minimize trace inductance
Pitfall 2: Inadequate Grounding
- *Problem*: Poor ground connection increases clamping voltage
- *Solution*: Use multiple vias to ground plane directly under device
Pitfall 3: Signal Integrity Degradation
- *Problem*: Excessive capacitance affecting high-speed signals
- *Solution*: Ensure total line capacitance (including PCB traces) remains below specification limits
### Compatibility Issues with Other Components
Microcontrollers/Processors :
- Compatible with most 3.3V and 5V logic families
- Verify I/O pin absolute maximum ratings exceed GBLC24 clamping voltage
Connectors :
- Works with standard USB, HDMI, Ethernet connectors
- Ensure connector shell is properly grounded separately from signal ground
Power Management ICs :
- Compatible with LDO regulators and switching converters
- Avoid sharing ground paths with noisy power circuits
### PCB Layout Recommendations
Placement Strategy :
```
Connector → GBLC24 (≤1cm) → Protected IC
↳ Ground via array
```
Routing Guidelines :
- Keep protected traces as short and direct as possible
- Maintain controlled impedance for high-speed signals
- Avoid 90° corners; use 45° angles or curves
Grounding Implementation :
- Use solid ground plane beneath device
- Multiple vias (minimum 2-4) connecting pad to ground plane
- Separate analog
