Scaling Processor # GF9320 Technical Documentation
*Manufacturer: GENNUM*
## 1. Application Scenarios
### Typical Use Cases
The GF9320 is a high-performance video processing integrated circuit designed for professional broadcast and industrial video applications. Primary use cases include:
- Video Routing Systems : Functions as a core component in 8×8 and 16×16 video routing matrices
- Format Conversion : Converts between SDI, HDMI, and analog video formats with minimal latency
- Signal Conditioning : Provides cable equalization for long-distance video transmission (up to 300 meters at 3G-SDI rates)
- Master Clock Generation : Serves as precision clock source in video production systems
### Industry Applications
- Broadcast Television : Used in production switchers, routing systems, and master control rooms
- Medical Imaging : Integrated into high-resolution surgical display systems and diagnostic equipment
- Professional AV : Deployed in large-scale video walls and digital signage networks
- Industrial Inspection : Utilized in machine vision systems requiring real-time video processing
### Practical Advantages and Limitations
Advantages:
- Supports multiple video standards (SD-SDI, HD-SDI, 3G-SDI) simultaneously
- Integrated cable driver with automatic equalization adjustment
- Low power consumption (typically 450mW) enables high-density designs
- Built-in error detection and reporting capabilities
Limitations:
- Maximum resolution limited to 1080p60 (3G-SDI)
- Requires external microcontroller for configuration management
- Limited support for emerging standards like 12G-SDI
- Higher cost compared to consumer-grade video processors
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: Improper Power Sequencing
- *Issue:* Simultaneous power application to analog and digital sections causes latch-up
- *Solution:* Implement staggered power-up sequence with 10ms delay between core and I/O supplies
Pitfall 2: Clock Jitter Accumulation
- *Issue:* Cascaded GF9320 devices without proper clock cleaning degrade signal integrity
- *Solution:* Use dedicated clock cleaning circuits between stages or enable internal reclocking
Pitfall 3: Thermal Management
- *Issue:* Operating at maximum data rates without adequate cooling reduces reliability
- *Solution:* Provide 15mm² copper pour on PCB and maintain airflow >1.5 m/s
### Compatibility Issues with Other Components
Memory Interfaces:
- Compatible with standard SPI flash (up to 16MB) for configuration storage
- Requires level translation when interfacing with 1.8V microcontrollers
Power Management:
- Must use low-noise LDO regulators (PSRR >60dB at 100kHz)
- Incompatible with switching regulators having ripple >10mVpp
Connector Systems:
- Optimized for BNC connectors with 75Ω characteristic impedance
- Requires impedance matching circuits when using alternative connectors
### PCB Layout Recommendations
Power Distribution:
- Use star topology for power routing with separate analog and digital grounds
- Place decoupling capacitors (100nF ceramic + 10μF tantalum) within 3mm of each power pin
- Implement power planes with minimum 2oz copper thickness
Signal Integrity:
- Maintain 75Ω controlled impedance for all differential pairs
- Route SDI signals as symmetrical differential pairs with length matching ±0.1mm
- Keep high-speed traces >5mm from board edges and other noise sources
Thermal Management:
- Use thermal vias (minimum 9 vias) under exposed pad connected to ground plane
- Allocate 10mm clearance around device for heat dissipation
- Consider thermal relief patterns for soldering process control
## 3. Technical Specifications
### Key Parameter Explanations
Video Performance:
- Data Rate
